Mediatek, a leading semiconductor company, has recently announced the latest addition to its 6000 series chipset lineup, the Dimensity 6100+. Designed for better power efficiency and Sub-6 5G connectivity, the chipset boasts a 20% power reduction compared to competitors. The Dimensity 6100+ is equipped with an advanced 5G modem, supporting up to 140MHz 2CC 5G Carrier Aggregation, which enables faster and more reliable connectivity. It has two Arm Cortex-A76 big cores and six Arm Cortex-A55 efficiency cores, providing high performance and power efficiency.
One of the critical features of the Dimensity 6100+ chipset is its support for up to a 108MP camera sensor, enabling high-resolution photography. However, it does not support Zero Shutter Lag. The chipset is expected to be available in the third quarter of 2023.
The Dimensity 6100+ is part of the affordable chipset series for mainstream 5G devices launched by MediaTek. The SoC delivers premium features, and the company is confident it will help bring 5G technology to a broader range of mobile devices. With Mediatek’s reputation for producing high-quality chipsets, the Dimensity 6100+ is expected to be well-received.
